Organic light emitting display device

ABSTRACT

An organic light emitting display device is disclosed, which removes an inorganic film from a bending area and minimizes a crack of a routing line to enable an extreme bending. The organic light emitting display device comprises a substrate having a display area and a bending area; a display assembly provided on a display area of the substrate; a routing line arranged on the bending area of the substrate and connected to the display assembly; and an organic layer provided on the bending area of the substrate, covering the routing line, wherein the bending area of the substrate has only the routing line and the organic layer.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of the Korean Patent Application No.(10-2017-0097342) filed on (Jul. 31, 2017), which is hereby incorporatedby reference for all purposes as if fully set forth herein.

BACKGROUND Technical Field

The present disclosure relates to an organic light emitting displaydevice.

Description of the Related Art

Recently, with the advancement of the information age, a demand for adisplay device for displaying an image has been increased in variousforms. Among the display devices, an organic light emitting displaydevice is a self-light emitting device, and has advantages of a wideviewing angle, an excellent contrast ratio and a fast response speed.Therefore, the organic light emitting display device has received muchattention as a next generation display device. Recently, an organiclight emitting display device of a slimmer size has been launched.Particularly, a flexible organic light emitting display device has manyadvantages in that it is easy to carry it and may be applied to variousshaped devices.

Since the flexible organic light emitting display device includes abending area that may fold a substrate and may reduce a bezel size byfolding the substrate at the bending area, the flexible organic lightemitting display device may be realized as an organic light emittingdisplay device having a narrow bezel.

However, as a bending level is increased to have a narrower bezel,problems occur in that an inorganic film included in the bending areamay be broken due to vulnerability to stress, and breaking occurs due toa crack generated in a routing line of the bending area.

BRIEF SUMMARY

Accordingly, the present disclosure is directed to an organic lightemitting display device that substantially obviates one or more problemsdue to limitations and disadvantages of the related art.

An advantage of the present disclosure is to provide an organic lightemitting display device that removes an inorganic film from a bendingarea and minimizes a crack of a routing line to enable an extremebending.

Additional advantages and features of the disclosure will be set forthin part in the description which follows and in part will becomeapparent to those having ordinary skill in the art upon examination ofthe following or may be learned from practice of the disclosure. Theobjectives and other advantages of the disclosure may be realized andattained by the structure particularly pointed out in the writtendescription and claims hereof as well as the appended drawings.

To achieve these objects and other advantages and in accordance with thepurpose of the disclosure, as embodied and broadly described herein,there is provided an organic light emitting display device comprising asubstrate having a display area and a bending area; a display assemblyprovided on a display area of the substrate; a routing line arranged onthe bending area of the substrate and connected to the display assembly;and an organic layer provided on the bending area of the substrate,covering the routing line, wherein the bending area of the substrate hasonly the routing line and the organic layer.

It is to be understood that both the foregoing general description andthe following detailed description of the present disclosure areexemplary and explanatory and are intended to provide furtherexplanation of the disclosure as claimed.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosure and are incorporated in and constitute apart of this application, illustrate embodiment(s) of the disclosure andtogether with the description serve to explain the principle of thedisclosure. In the drawings:

FIG. 1 is a plane view illustrating an organic light emitting displaydevice according to one embodiment of the present disclosure;

FIG. 2 is a cross-sectional view illustrating that an organic lightemitting display device of FIG. 1 is folded;

FIG. 3 is a cross-sectional view taken along the folded line I-I′ ofFIG. 1, illustrating an organic light emitting display device accordingto one embodiment of the present disclosure;

FIG. 4 is a cross-sectional view illustrating an organic light emittingdisplay device according to one embodiment of the present disclosure,wherein a structure of a bending area is enlarged in an organic lightemitting display device shown in FIG. 3;

FIG. 5 is a cross-sectional view illustrating an organic light emittingdisplay device according to one embodiment of the present disclosure,wherein a structure of a substrate is varied from an organic lightemitting display device shown in FIG. 3; and

FIG. 6 is a cross-sectional view illustrating an organic light emittingdisplay device according to one embodiment of the present disclosure,wherein a lower film is additionally provided in an organic lightemitting display device shown in FIG. 4.

DETAILED DESCRIPTION

Advantages and features of the present disclosure, and implementationmethods thereof will be clarified through following embodimentsdescribed with reference to the accompanying drawings. The presentdisclosure may, however, be embodied in different forms and should notbe construed as limited to the embodiments set forth herein. Rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the scope of the present disclosureto those skilled in the art. Further, the present disclosure is onlydefined by scopes of claims.

A shape, a size, a ratio, an angle, and a number disclosed in thedrawings for describing embodiments of the present disclosure are merelyan example, and thus, the present disclosure is not limited to theillustrated details. Like reference numerals refer to like elementsthroughout the specification. In the following description, when thedetailed description of the relevant known function or configuration isdetermined to unnecessarily obscure the important point of the presentdisclosure, the detailed description will be omitted.

In a case where ‘comprise’, ‘have’, and ‘include’ described in thepresent specification are used, another part may be added unless ‘only˜’is used. The terms of a singular form may include plural forms unlessreferred to the contrary. If the term, “only” is used, then it means noother parts or structures are present.

In construing an element, the element is construed as including atolerance or an error range, even if there is no explicit description.

In describing a position relationship, for example, when the positionrelationship is described as ‘upon˜’, ‘above˜’, ‘below˜’, and ‘nextto˜’, one or more parts may be arranged between two other parts unless‘just’ or ‘direct’ is used.

In describing a time relationship, for example, when the temporal orderis described as ‘after˜’, ‘subsequent˜’, ‘next˜’, and ‘before˜’, a casewhich is not continuous may be included unless ‘just’ or ‘direct’ isused.

It will be understood that, although the terms “first”, “second”, etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the present disclosure.

“A first horizontal-axis direction”, “a second horizontal-axisdirection” and “a vertical-axis direction” should not be construed by ageometric relation only of a mutual vertical relation, and may havebroader directionality within the range that elements of the presentdisclosure may act functionally.

The term “at least one” should be understood as including any and allcombinations of one or more of the associated listed items. For example,the meaning of “at least one of a first item, a second item, and a thirditem” denotes the combination of all items proposed from two or more ofthe first item, the second item, and the third item as well as the firstitem, the second item, or the third item.

Features of various embodiments of the present disclosure may bepartially or overall coupled to or combined with each other, and may bevariously inter-operated with each other and driven technically as thoseskilled in the art can sufficiently understand. The embodiments of thepresent disclosure may be carried out independently from each other, ormay be carried out together in co-dependent relationship.

Hereinafter, the preferred embodiments of the present disclosure will bedescribed in detail with reference to the accompanying drawings.Wherever possible, the same reference numbers will be used throughoutthe drawings to refer to the same or like parts.

FIG. 1 is a plane view illustrating an organic light emitting displaydevice according to one embodiment of the present disclosure in theunfolded position and FIG. 2 is a cross-sectional view illustrating thatan organic light emitting display device of FIG. 1 after it is folded.

Referring to FIGS. 1 and 2, the organic light emitting display deviceaccording to one embodiment of the present disclosure comprises asubstrate 100, a display assembly AP, a driver 300, and a circuit board400.

The substrate 100 is a thin film transistor array substrate, and may bemade of a glass or plastic material. The substrate 100 according to oneembodiment includes a display area AA and a non-display area IA.

The display area AA is provided at a part other than edge parts of thesubstrate 100. The display area AA may be defined as an area where adisplay assembly AP for displaying an image is arranged.

The non-display area IA is provided at a part other than the displayarea AA provided in the substrate 100, and may be defined as the edgeparts of the substrate 100 surrounding the display area AA. Thenon-display area IA is in the periphery outside the display area AA, andan image is not displayed on the non-display area IA unlike the displayarea AA. The non-display area IA includes a bending area BA connectedwith the driver 300.

The bending area BA is an area arranged in the non-display area IA, andis an area where a routing line 210 for connecting the driver 300 withthe display assembly AP is arranged. The bending area BA is an areaprovided to fold a part of the non-display area IA in one direction, andserves to reduce a bezel of the organic light emitting display deviceaccording to the present disclosure. An element for facilitating bendingis arranged in the bending area BA according to one embodiment, and itsdetailed structure will be described later.

The display assembly AP is provided on the display area AA of thesubstrate 100. The display assembly AP according to one embodiment isconnected with the driver 300 through the routing line 210, and displaysan image by receiving image data supplied from a display driving system.A detailed structure of the display assembly AP will be described later.

The driver 300 is connected to a pad part provided in the non-displayarea IA of the substrate 100, and displays an image corresponding to theimage data supplied from the display driving system on the display areaAA. The driver 300 according to one embodiment includes a drivingcircuit, and may be a chip on film structure. For example, the driver300 includes a flexible film, a driving IC (302) arranged on theflexible film, and a plurality of driving terminals arranged at one edgeof the flexible film.

The circuit board 400 is electrically connected with the driver 300. Thecircuit board 400 according to one embodiment serves to transfer asignal and power between elements of the driver 300. The circuit board400 may be a printed circuit board having flexibility.

Referring to FIG. 2 again, the bending area BA of the substrate 100 maybe folded in one direction. In detail, a bending line BL may be arrangedat a distance spaced apart from the edges of the display assembly APformed on the substrate 100. The bending line BL may be a line forfolding the substrate 100. As the bending line BL is arranged to adjointhe edges of the display assembly AP, a bezel of the organic lightemitting display device may be minimized.

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 1,illustrating an organic light emitting display device according to oneembodiment of the present disclosure, and FIG. 4 is a cross-sectionalview illustrating an organic light emitting display device according toone embodiment of the present disclosure, wherein a structure of abending area is enlarged in an organic light emitting display deviceshown in FIG. 3.

Referring to FIGS. 3 and 4, the organic light emitting display deviceaccording to on embodiment includes a substrate 100, a display assemblyAP, a routing line 210, and an organic layer OL.

The substrate 100 is a thin film transistor array substrate, and may bemade of a glass or plastic material. The substrate 100 according to oneembodiment includes a display area AA and a bending area BA. Thesubstrate 100 may be formed to have the same thickness on the displayarea AA and the bending area BA.

The display assembly AP is provided on the display area AA of thesubstrate 100. The display assembly AP according to one embodimentincludes a buffer layer 105, a thin film transistor 120, a firstplanarization layer 130 a, a first bank layer 140 a, a first pacer 150a, a first electrode E1, a light emitting layer EL, a second electrodeE2, and an encapsulation layer 160.

The buffer layer 105 is provided on the display area AA of the substrate100. The buffer layer 105 according to one embodiment serves to preventwater from being permeated into the display assembly AP. The bufferlayer 105 may be made of, but not limited to, an inorganic insulatingmaterial, for example, a silicon dioxide (SiO₂), a silicon nitride(SiNx) or a multi-layered layer of SiO₂ and SiNx.

The thin film transistor 120 is provided on the buffer layer 105. Thethin film transistor 120 controls the amount of a current flowing fromthe driver 300 to the light emitting layer EL. To this end, the thinfilm transistor 120 includes a gate electrode, a drain electrode, and asource electrode. The thin film transistor 120 may allow a lightemitting diode formed in the light emitting layer EL to emit light atbrightness proportional to a data signal supplied from a data line bycontrolling a data current flowing from the driver 300 to the lightemitting layer EL.

The thin film transistor 120 according to one embodiment may include agate insulating layer 110 for covering a gate electrode. The gateinsulating layer 110 may include a single layer or a plurality of layersmade of an inorganic material, and may be made of a silicon oxide(SiOx), a silicon nitride (SiNx), etc.

The first planarization layer 130 a is provided in the display area AAof the substrate 100 to cover the thin film transistor 120. The firstplanarization layer 130 a provides a planarization surface on the thinfilm transistor 120 while protecting the thin film transistor 120. Thefirst planarization layer 130 a according to one embodiment may be madeof an organic material such as benzocyclobutene and photo acryl, but maypreferably be made of a photo acrylic material for convenience ofprocess.

The first bank layer 140 a is provided on the first planarization layer130 a to cover edge parts of the first electrode E1 and the thin filmtransistor 120, thereby defining an opening area which forms a lightemitting area. The first bank layer 140 a according to one embodimentmay include an organic material such as benzocyclobutadiene, acryl andpolyimide. Additionally, the first bank layer 140 a may be formed of aphotoresist material containing a black pigment. In this case, the firstbank layer 140 a serves as a light-shielding member (or black matrix).

The first spacer 150 a is provided at edge parts of the first bank layer140 a. The first spacer 150 a is provided to prevent a dark spot defectfrom occurring due to a contact between a mask and the first electrodeE1 during a deposition process of the light emitting layer EL. The maskhas a sagging part which may be in contact with the first electrode E1.The first spacer 150 a according to one embodiment may be provided onthe first bank layer 140 a to allow the mask to be spaced apart from thefirst electrode E1. Therefore, since the mask and the first electrode E1are not in contact with each other, a dark spot defect may be preventedfrom occurring.

The first electrode E1 is an anode electrode, and is provided on thefirst planarization layer 130 a in a pattern shape. The first electrodeE1 according to one embodiment is electrically connected with the sourceelectrode of the thin film transistor through a contact hole provided inthe first planarization layer 130 a to receive a data current outputfrom the thin film transistor. The first electrode E1 may be made of ametal material having high reflectivity, and for example, may include,but is not limited to, a material such as Au, Ag, Al, Mo and Mg, ortheir alloy.

The light emitting layer EL is provided on the first electrode E1 of theopening area defined by the first bank layer 140 a. The light emittinglayer EL according to one embodiment may include a hole injecting layer,a hole transporting layer, an organic light emitting layer, an electrontransporting layer, and an electron injecting layer. In this case, theone or two or more of the hole injecting layer, the hole transportinglayer, the electron transporting layer and the electron injecting layermay be omitted. Also, the light emitting layer EL may further include atleast one function layer for controlling electrons and/or holes injectedinto the organic light emitting layer.

The second electrode E2 is provided on the substrate 100 to cover thelight emitting layer EL and the first bank layer 140 a, and is commonlyconnected with the light emitting layer EL. The second electrode E2 maybe defined as a cathode electrode or common electrode in accordance witha direction of a current flowing to the light emitting layer EL. Thesecond electrode E2 receives a cathode power supply provided from thedriver 300. In this case, the cathode power supply may be a groundvoltage or a direct current voltage having a predetermined level.

The second electrode E2 according to one embodiment may be made of atransparent metal material having high light transmittance. For example,the second electrode E2 may include ITO (indium tin oxide), IZO (indiumzinc oxide), IZTO (indium zinc tin oxide), ICO (indium cesium oxide) orIWO (indium tungsten oxide), which is a transparent conductive materialsuch as TCO (transparent conductive oxide). Selectively, in thisembodiment, to minimize damage of the light emitting layer EL due to aprocess temperature when the second electrode E2 is formed, the secondelectrode E2 may be formed of an amorphous transparent conductivematerial by a low temperature metal deposition process having a processtemperature less than 100° C. That is, if the second electrode E2 isformed of a crystalline transparent conductive material, a problemoccurs in that the light emitting layer EL is damaged by a hightemperature heat treatment process performed for the second electrode E2to obtain a low resistance value. Therefore, it is preferable that thesecond electrode E2 is formed of an amorphous transparent conductivematerial by a low pressure metal deposition process.

The encapsulation layer 160 is provided on the light emitting layer ELto protect the light emitting layer EL vulnerable to external water oroxygen by preventing water from being permeated into the light emittinglayer EL. That is, the encapsulation layer 160 is provided on thesubstrate 100 to cover the second electrode E2. The encapsulation layer160 according to one embodiment may be formed of an inorganic layer ororganic layer, or may be formed of a multi-layered structure in whichthe inorganic layer and the organic layer are deposited alternately.

The routing line 210 is provided on the bending area BA of the substrate100. The routing line 210 according to one embodiment serves toelectrically connect the driver 300 with the display assembly AP, andmay be formed of a metal line.

The routing line 210 according to one embodiment may be formed of alinear metal line to have a fine pattern due to UHD design of theorganic light emitting display device. Since the routing line 210 shouldtransmit a data signal to the display assembly AP within a limitedspace, a line width and a line interval may be formed to have a rangefrom 2 μm to 4 μm.

The routing line 210 according to one embodiment includes a first metallayer 212, a second metal layer 214, and a third metal layer 216.

The first metal layer 212 is provided at the lowest part of the routingline 210 in direct contact with the substrate 100. The first metal layer212 according to one embodiment may be formed of a metal, such as Ti,which has high solidity as compared to aluminum, and therefore mayprotect the routing line 210 from external impact.

The second metal layer 214 is provided on the first metal layer 212. Thesecond metal layer 214 according to one embodiment may be formed of ametal, such as Al, which has good malleability and ductility. The secondmetal layer 214 is formed to have a thickness thicker than the firstmetal layer 212 and the third metal layer 216. Note that FIG. 4 is notto scale for the thickness of the layers 100, 212, 214 and 216. In apreferred embodiment, layer 214 will be measurable thicker than layers212 or 216. Since layer 214 is more malleable and ductile than layer212, it can be made thicker, in some cases, more than twice as thick.Substrate 100 may also be thicker than each of the layers 212, 214, 216,and in some cases, thicker than the combination of all these layers 210,see for example FIGS. 2 and 3, which are drawn having a differentrelative scale.

The third metal layer 216 is provided on the second metal layer 214. Thethird metal layer 216 according to one embodiment may be formed of thesame material as that of the first metal layer 212 to protect therouting line 210 from external impact, and is preferably formed at thesame thickness as that of the first metal layer 212.

The organic layer OL is provided on the bending area BA of the substrate100 to cover the routing line 210. The organic layer OL according to oneembodiment is formed of only an organic material that may be depositedduring a deposition process of the display area AA of the substrate 100.The organic layer OL includes a second planarization layer 130 b, asecond bank layer 140 b, a second spacer 150 b, and a micro-coatinglayer 230.

The second planarization layer 130 b is provided at the lowest part ofthe organic layer OL to cover the routing line 210. The secondplanarization layer 130 b provides a planarization surface on therouting line 210 while protecting the routing line 210. The secondplanarization layer 130 b according to one embodiment is made of thesame organic material as that of the first planarization layer 130 a,and is patterned during a deposition process for forming the firstplanarization layer 130 a and thus formed together with the firstplanarization layer 130 a.

The second bank layer 140 b is provided on the second planarizationlayer 130 b. The second bank layer 140 b according to one embodiment ismade of the same organic material as that of the first bank layer 140 a,and is patterned during a deposition process for forming the first banklayer 140 a and thus formed together with the first bank layer 140 a.

The second spacer 150 b is provided on the second bank layer 140 b. Thesecond spacer 150 b according to one embodiment is made of the sameorganic material as that of the first spacer 150 a, and is patternedduring a deposition process for forming the first spacer 150 a and thusformed together with the first spacer 150 a.

The micro-coating layer 230 is provided on the entire surface of thebending area BA of the substrate 100 to cover the second spacer 150 b.The micro-coating layer 230 according to one embodiment may be made of aphoto-hardening resin, and may be coated on target areas of the organiclight emitting display device according to the present disclosure. Inthis respect, the micro-coating layer 230 may be coated on the entiresurface of the bending area BA.

The micro-coating layer 230 according to one embodiment may be coated ata predetermined thickness to control a neutral plane NP of a part formedon the bending area BA of the substrate 100 in the organic lightemitting display device according to this embodiment. In more detail,the neutral plane NP in the bending area BA of the organic lightemitting display device may be controlled to be arranged on the routingline 210 by the micro-coating layer 230.

The substrate 100 is stretched at one side and shrunk at the other sidean amount based on its relative location as a plane as the substrate 100is bent. When the entire structure is bent, a neutral plane NP ispresent throughout the bend. The NP is that plane which is neitherstretched or shrunk when the entire substrate structure 100 is bent.Namely, it suffers no elastic deformation. Hereinafter, the neutralplane NP means a neutral plane NP of a part formed in the bending areaBA of the substrate 100 in the organic light emitting display deviceaccording to this embodiment. In the organic light emitting displaydevice according to one embodiment, the organic layer OL may be formedon the bending area BA to control the location of the neutral plane NP.For example, as the micro-coating layer 230 is coated thickly, theneutral plane NP ascends toward the upper part of the substrate and thenmay be arranged on the routing line 210. As the second spacer 150 b isformed on the bending area BA, the neutral plane NP ascends byincreasing the thickness of the second spacer 150 b, whereby the neutralplane NP may be arranged to be located on an area more vulnerable tostress even on the routing line 210.

The thickness of spacer layer 150 b and the micro-coating layer 230 areselected to place the NP at a selected location in the routing line 210.If the neutral plane NP is arranged to be in the routing line 210, thiswill result in that particular plane in the routing line 210 not beingcompressed or stretched at all when the substrate 100 is bent. Inaddition, the entire routing line will be very close to the NP, someparts just slightly above it and some parts just slightly below it, sothe entire routing line 210 will undergo very little compression orstretching when the substrate 100 is folded. The routing line 210 istherefore subjected to bending stress within a minimum range and thestress may be minimized, a crack is not generated in routing line 210,even in the case of an extreme bending, whereby the organic lightemitting display device may have a narrower bezel.

In this way, the routing line 210 and the organic layer OL are onlyformed on the bending area BA of the substrate 100, and no inorganicfilm is formed thereon. Since the inorganic film is vulnerable to stressto increase a bending level, the inorganic film is easily broken,whereby there is a difficulty in that the organic light emitting displaydevice has a narrower bezel. On the other hand, since the organic lightemitting display device according to the present disclosure has astructure in which an inorganic film is completely removed from thebending area, the organic light emitting display device of the presentdisclosure may have a narrower bezel because a crack is not generatedeven in case of an extreme bending.

FIG. 5 is a cross-sectional view illustrating an organic light emittingdisplay device according to one embodiment of the present disclosure,wherein a structure of a substrate is varied from an organic lightemitting display device shown in FIG. 3.

Referring to FIG. 5, the organic light emitting display device accordingto one embodiment of the present disclosure includes a concave part 220arranged on the bending area BA of the substrate 100 and concavelyformed from the substrate 100. Hereinafter, repeated description ofelements repeated with those of FIG. 3 will be omitted, and descriptionwill be given based on the concave part 220.

The concave part 220 is concavely provided in the bending area BA tohave a certain depth D from the upper surface of the substrate formed inthe display area AA. At this time, the concave part 220 may be formed tohave a depth set such that the neutral plane NP may be arranged on therouting line 210. For example, the concave part 220 may be provided tohave a depth of 2 μm from the upper surface of the substrate 100 formedin the display area AA. The concave part 220 may have, but not limitedto, a groove or cup shape.

The concave part according to one embodiment includes a bottom surface,which has a depth D from the upper surface of the substrate 100 formedin the display area AA. The routing line 210 is provided on the bottomsurface of the concave part 220, and is formed to be directly in contactwith the bottom surface of the concave part 220.

The concave part 220 according to one embodiment may arrange the neutralplane NP on the routing line 210. The routing line 210 may generate acrack during bending and may cause breaking, whereby there is adifficulty in that the organic light emitting display device has anarrower bezel. If the neutral plane NP is arranged on the routing line210, since the routing line 210 may be subjected to bending stresswithin a minimum range, stress may be minimized, and a crack is notgenerated even in case of an extreme bending, whereby the organic lightemitting display device may have a narrower bezel.

The neutral plane NP may be arranged on the second metal layer 214 bythe concave part 220 as shown in FIG. 4. The second metal layer 214 isformed of a material having high malleability, and severs to transmit adata signal to the display assembly AP. If a crack is generated in thesecond metal layer 214, breaking may be caused, whereby it is preferablefor an extreme bending that the neutral plane NP is arranged on thesecond metal layer 214.

FIG. 6 is a cross-sectional view illustrating an organic light emittingdisplay device according to one embodiment of the present disclosure,wherein a lower film is additionally provided in an organic lightemitting display device shown in FIG. 4.

Referring to FIG. 6, the organic light emitting display device accordingto one embodiment of the present disclosure includes a lower film 205provided on the concave part 220. Hereinafter, repeated description ofelements repeated with those of FIGS. 3 and 5 will be omitted, anddescription will be given based on the lower film 205.

The lower film 205 is interposed between the bottom surface of theconcave part 220 and the routing line 210. The lower film 205 isprovided to facilitate adhesion between the substrate h made of aplastic or glass material and the routing line 210 made of a metalmaterial. The lower film may be made of an organic material such asbenzocyclobutene and photo acryl, but may preferably be made of a photoacrylic material for convenience of process. That is, since the lowerfilm 205 is interposed between the substrate 100 and the routing line210, the substrate 100 is not directly coupled with the routing line 210but coupled with the routing line 210 through the lower film 205 formedon the substrate 100, whereby a coupling force may be reinforced.

As described above, the organic light emitting display device accordingto the present disclosure has an advantage in that it is optimized toreduce the stress in the metal routing line 210 to enable an extremebending of the bending area.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present disclosurewithout departing from the spirit or scope of the disclosures. Thus, itis intended that the present disclosure covers the modifications andvariations of this disclosure provided they come within the scope of theappended claims and their equivalents. Thus, the above embodiments areto be considered in all respects as illustrative and not restrictive.The scope of the disclosure should be determined by reasonableinterpretation of the appended claims and all change which comes withinthe equivalent scope of the disclosure are included in the scope of thedisclosure.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet areincorporated herein by reference, in their entirety. Aspects of theembodiments can be modified, if necessary to employ concepts of thevarious patents, applications and publications to provide yet furtherembodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

What is claimed is:
 1. An organic light emitting display devicecomprising: a substrate having a display area and a bending area; adisplay assembly located on a display area of the substrate; a routingline positioned on the bending area of the substrate and connected tothe display assembly; and an organic layer positioned on the bendingarea of the substrate, covering the routing line, wherein the onlystructures on the bending area of the substrate are the routing line andthe organic layer, wherein the organic layer includes: a secondplanarization layer covering the routing line; a second bank layerpositioned on the second planarization layer; and a micro-coating layerpositioned on the second bank layer, the micro-coating layer covering anentire surface of the substrate formed in the bending area.
 2. Theorganic light emitting display device of claim 1, wherein the displayassembly includes: a buffer layer positioned on the substrate; a thinfilm transistor positioned on the buffer layer, the thin film transistorcontrolling a data current to a light emitting layer; a firstplanarization layer covering the thin film transistor; a first banklayer positioned on the first planarization layer, the first bank layerdefining a light emitting area; the light emitting layer located in thelight emitting area on the first planarization layer and connected tothe thin film transistor; and an encapsulation layer covering the lightemitting layer.
 3. The organic light emitting display device of claim 2,further comprising: a first spacer positioned on the first bank layer,spacing a mask apart from the substrate during a deposition process. 4.The organic light emitting display device of claim 2, wherein theorganic layer further includes a second spacer positioned on the secondbank layer and the micro-coating layer covers the second spacer.
 5. Theorganic light emitting display device of claim 1, wherein the substratethickness in the bending area is thinner than the substrate thickness inthe display area.
 6. The organic light emitting display device of claim1, further comprising a concave part located in the bending area andconcavely formed from the substrate, wherein the routing line isdirectly in contact with a bottom surface of the concave part.
 7. Theorganic light emitting display device of claim 1, further comprising aconcave part located in the bending area and concavely formed from thesubstrate; and a lower film formed between the bottom surface of theconcave part and the routing line, wherein the lower film is made of anorganic material.
 8. The organic light emitting display device of claim1, wherein the bending area has a neutral plane located in the routingline.
 9. The organic light emitting display device of claim 8, whereinthe routing line includes: a first metal layer on the substrate; asecond metal layer on the first metal layer; and a third metal layer onthe second metal layer, wherein the neutral plane of the bending area islocated in the second metal layer.